KLMBG4GESD-B04Q

KLMBG4GESD-B04Q

eMMC

SAMSUNG/三星

32GB

1.8/3.3V

-40℃~85℃

FBGA-153

Mass Production

11.5mm x 13mm x 1.0mm

5.1

HS400

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KLMBG4GESD-B04P

KLMBG4GESD-B04P

eMMC

SAMSUNG/三星

32GB

1.8/3.3V

-40℃~85℃

BGA

Mass Production

11.5mm x 13mm x 1.0mm

5.1

HS400

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KLMBG4GESD-B03P

KLMBG4GESD-B03P

eMMC

SAMSUNG/三星

32GB

1.8/3.3V

-40℃~85℃

BGA-153

Mass Production

11.5mm x 13mm x 1.0mm

5.0

HS400

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KLMBG4GEND-B031

KLMBG4GEND-B031

eMMC

SAMSUNG/三星

32GB

1.8/3.3V

-25°C~85°C

FBGA-153

Archived

11.5mm x 13mm x 1.0mm

5.0

HS400

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KLMBG4GE4A-A001

KLMBG4GE4A-A001

eMMC

SAMSUNG/三星

32GB

2.7V~3.6V

-25°C~85°C

FBGA-169

12mm x 16mm x 1.0mm

4.41

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KLMAG2GESD-B04Q

KLMAG2GESD-B04Q

eMMC

SAMSUNG/三星

16GB

1.8/3.3V

-40℃~105℃

FBGA-153

Mass Production

11.5mm x 13mm x 0.8mm

5.1

HS400

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KLMAG2GESD-B04P

KLMAG2GESD-B04P

eMMC

SAMSUNG/三星

16Gb

1.8/3.3V

-40℃~85℃

FBGA-153

Mass Production

11.5mm x 13mm x 0.8mm

5.1

hS400

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KLMAG1JENB-B041

KLMAG1JENB-B041

eMMC

SAMSUNG/三星

16GB

1.8/3.3V

-25°C~85°C

BGA-153

Archived

11.5mm x 13mm x 0.8mm

5.1

HS400

点击查看

KLM8G1WEPD-B031

KLM8G1WEPD-B031

eMMC

SAMSUNG/三星

8GB

1.8/3.3V

-25°C~85°C

BGA-153

Archived

11.5mm x 13mm x 0.8mm

5.0

HS400

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KLM8G1WEMB-B031

KLM8G1WEMB-B031

eMMC

SAMSUNG/三星

8GB

2.7V~3.6V

-25°C~85°C

FBGA-153

11.5mm x 13mm x 0.8mm

5.0

HS400

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KLM8G1GEUF-B04P

KLM8G1GEUF-B04P

eMMC

SAMSUNG/三星

8GB

1.8/3.3V

-40℃~85℃

FBGA-153

Mass Production

11.5mm x 13mm x 0.8mm

5.1

HS400

点击查看

KLM8G1GESD-B04P

KLM8G1GESD-B04P

eMMC

SAMSUNG/三星

8GB

1.8/3.3V

-40℃~85℃

BGA-153

Mass Production

11.5mm x 13mm x 0.8mm

5.1

HS400

点击查看

KLM8G1GESD-B03Q

KLM8G1GESD-B03Q

eMMC

SAMSUNG/三星

8GB

1.8/3.3V

-40℃~105℃

FBGA-153

Mass Production

11.5mm x 13mm x 0.8mm

5.0

HS400

点击查看

KLM8G1GESD-B03P

KLM8G1GESD-B03P

eMMC

SAMSUNG/三星

8GB

1.8/3.3V

-40℃~85℃

FBGA-153

Mass Production

11.5mm x 13mm x 0.8mm

5.0

HS400

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KLM8G1GEME-B041

KLM8G1GEME-B041

eMMC

SAMSUNG/三星

8GB

1.8/3.3V

-25°C~85°C

FBGA-153

Archived

11.5mm x 13mm x 0.8mm

5.1

HS400

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KLM8G1GEAC-B001

KLM8G1GEAC-B001

eMMC

SAMSUNG/三星

8GB

2.7V~3.6V

-25°C~85°C

FBGA-153

11.5mm x 13mm x 1.0mm

4.5

HS200

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KLM4G1FETE-B041

KLM4G1FETE-B041

eMMC

SAMSUNG/三星

4GB

1.8~3.3V

-25°C~85°C

FBGA-153

Mass Production

11mm x 10mm x 0.8mm

5.1

HS400

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KMGP6001BA-B514

KMGP6001BA-B514

eMCP

SAMSUNG/三星

32GB

1866Mbps

FBGA-221

EOL

eMMC 5.1

32GB

16Gb

LPDDR3

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KMQE60013B-B318

KMQE60013B-B318

eMCP

SAMSUNG/三星

16GB

1866Mbps

FBGA-221

Mass Production

eMMC 5.1

16GB

16Gb

LPDDR3

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KMGX6001BA-B514

KMGX6001BA-B514

eMCP

SAMSUNG/三星

32GB

1866Mbps

FBGA-221

Mass Production

eMMC 5.1

32GB

24Gb

LPDDR3

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