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model
specification
DRAM type
capacity
framework
speed
working voltage
operation temperature
product details
THGBMJG8C2LBAIL
eMMC
Toshiba/KIOXIA东芝/铠侠
32GB
2.7V~3.6V
-25℃~85℃
BGA-153
11.5mm×13.0mm×0.8mm
5.1
15nm
Click view
THGBMJG7C1LBAIL
16GB
THGBMJG6C1LBAU7
8GB
400mb/s
-40℃~105℃
11.5mm×13.0mm×1.0mm
THGBMJG6C1LBAIL
THGBM4G5D1HBAIR
BGA
THGAMVT0T43BAIR
128GB
THGAMVG9T23BAIL
64GB
THGAMRT0T43BAIR
THGAMRG9T23BAIL
THGAMRG8T13BAIL
THGAMRG7T13BAIL
THGAMVG8T13BAIL
KIOXIA铠侠
-25°C~85°C
11.5mm×13mm×0.8mm
HS400
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