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DRAM SSD eMMC eMCP FLASH UFS

PRODUCT MODEL

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model	DRAM type	capacity	framework	speed	working voltage	operation temperature	product details
K4A4G165WF-BCTD	K4A4G165WF-BCTD	DRAM DDR4	SAMSUNG/三星	4Gb	256Mx16	2666Mbps	1.2V	0°C~85°C	FBGA-96	Mass Production				Click view
K4B4G1646E-BCNB	K4B4G1646E-BCNB	DRAM DDR3	SAMSUNG/三星	4Gb	512Mx8	2133Mbps	1.5V	0°C~85°C	FBGA-96	Mass Production				Click view
K4B4G1646E-BYMA	K4B4G1646E-BYMA	DRAM DDR3	SAMSUNG/三星	4Gb	512Mx8	1866Mbps	1.35V	0°C~85°C	FBGA-96	Mass Production				Click view
K4ZAF325BM-HC16	K4ZAF325BM-HC16	DRAM GDDR6	SAMSUNG/三星	16Gb	512Mx32	16.0Gbps			FBGA-180	EOL				Click view
KLMDG4UCTB-B041	KLMDG4UCTB-B041	eMMC	SAMSUNG/三星	128GB			1.8/3.3V	-25°C~85°C	BGA	Mass Production	11.5mm x 13mm x 1.0mm	5.1	HS400	Click view
K4ABG165WB-MCWE	K4ABG165WB-MCWE	DRAM DDR4	SAMSUNG/三星	32Gb	2Gx16	3200Mbps	1.2V	0°C~85°C	FBGA-96	Mass Production				Click view
K4ABG085WA-MCTD	K4ABG085WA-MCTD	DRAM DDR4	SAMSUNG/三星	32Gb	4Gx8	2666Mbps	1.2V	0°C~85°C	FBGA-78	Mass Production				Click view
K4AAG165WB-MCTD	K4AAG165WB-MCTD	DRAM DDR4	SAMSUNG/三星	16Gb	1Gx16	2666Mbps	1.2V	0°C~85°C	FBGA-96	Mass Production				Click view
K4AAG165WB-BCWE	K4AAG165WB-BCWE	DRAM DDR4	SAMSUNG/三星	16Gb	4Gx4	3200Mbps	1.2V	0°C~85°C	FBGA-78	Mass Production				Click view
K4AAG165WA-BIWE	K4AAG165WA-BIWE	DRAM DDR4	SAMSUNG/三星	16Gb	1Gx16	3200Mbps	1.2V	-40°C~95°C	FBGA-96	Mass Production				Click view
KLUDG8J1ZD-C0CP	KLUDG8J1ZD-C0CP	UFS	SAMSUNG/三星	128GB			1.8/3.3V	-40°C~95°C	BGA	Mass Production	11.5mm x 13mm x 1.2mm	2.1	G3 2Lane	Click view
KLUDG8J1ZD-C0CQ	KLUDG8J1ZD-C0CQ	UFS	SAMSUNG/三星	128GB			1.8/3.3V	-40℃~105℃	BGA	Mass Production	11.5mm x 13mm x 1.2mm	2.1	G3 2Lane	Click view
KLUCG4J1ZD-C0CP	KLUCG4J1ZD-C0CP	UFS	SAMSUNG/三星	128GB			1.8/3.3V	-40°C~95°C	BGA	Mass Production	11.5mm x 13mm x 1.2mm	2.1	G3 2Lane	Click view
KLUCG4J1ZD-C0CQ	KLUCG4J1ZD-C0CQ	UFS	SAMSUNG/三星	32GB			1.8/3.3V	-40°C~95°C	BGA	Mass Production	11.5mm x 13mm x 1.2mm	2.1	G3 2Lane	Click view
KLMCG4JEUD-B04P	KLMCG4JEUD-B04P	eMMC	SAMSUNG/三星	64GB			1.8/3.3V	-40℃~85℃	BGA	Mass Production	11.5mm x 13mm x 1.2mm	5.1	HS400	Click view
KLMBG4GEUF-B04Q	KLMBG4GEUF-B04Q	eMMC	SAMSUNG/三星	32GB			1.8/3.3V	-40℃~105℃	BGA	Mass Production	11.5mm x 13mm x 0.8mm	5.1	HS400	Click view
KLM8G1GEUF-B04Q	KLM8G1GEUF-B04Q	eMMC	SAMSUNG/三星	8GB			1.8/3.3V	-40℃~105℃	BGA	Mass Production	11.5mm x 13mm x 0.8mm	5.1	HS400	Click view
K4UJE3Q4AA-TFCL	K4UJE3Q4AA-TFCL	DRAM LPDDR4X	SAMSUNG/三星	48Gb	x32	4266Mbps	1.8/1.1/0.6V	-40°C~95°C	FBGA-200	Mass Production				Click view
K4UJE3Q4AA-THCL	K4UJE3Q4AA-THCL	DRAM LPDDR4X	SAMSUNG/三星	48Gb	x32	4266Mbps	1.8/1.1/0.6V	-40℃~105℃	FBGA-200	Mass Production				Click view
K4UBE3D4AM-TFCL	K4UBE3D4AM-TFCL	DRAM LPDDR4X	SAMSUNG/三星	32Gb	x32	4266Mbps	1.8/1.1/0.6V	-40°C~95°C	FBGA-200	Mass Production				Click view