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model
specification
DRAM type
capacity
framework
speed
working voltage
operation temperature
product details
KLM8G1GESD-B04P
eMMC
SAMSUNG/三星
8GB
1.8/3.3V
-40℃~85℃
BGA-153
Mass Production
11.5mm x 13mm x 0.8mm
5.1
HS400
Click view
KLM8G1GESD-B03Q
-40℃~105℃
FBGA-153
5.0
KLM8G1GESD-B03P
KLM8G1GEME-B041
-25°C~85°C
Archived
KLM8G1GEAC-B001
2.7V~3.6V
11.5mm x 13mm x 1.0mm
4.5
HS200
KLM4G1FETE-B041
4GB
1.8~3.3V
11mm x 10mm x 0.8mm
KMGP6001BA-B514
eMCP
32GB
1866Mbps
FBGA-221
EOL
eMMC 5.1
16Gb
LPDDR3
KMQE60013B-B318
16GB
KMGX6001BA-B514
24Gb
KMFN60012B-B214
8Gb
KMDX60018M-B425
4266Mbps
FBGA-254
LPDDR4X
KMDP6001DA-B425
64GB
32Gb
KMDH6001DM-B422
3733Mbps
K4AAG165WA-BCWE
DRAM DDR4
1Gx16
3200Mbps
1.2V
0°C~85°C
FBGA-96
K4AAG165WA-BCTD
2666Mbps
K4A8G165WC-BCWE
512Mx16
Sample
K4A8G085WC-BCWE
1Gx8
FBGA-78
K4A8G085WC-BCTD
K4A4G165WE-BCRC
4Gb
256Mx16
2400Mbps
K4A4G085WE-BCRC
512Mx8
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